G. BAHAR BASIM
Ozyegin University,
Nisantape Mevki Orman Sokak No: 13
34794 Alemdag, Cekmekoy, Istanbul, TURKEY
Bahar.Basim@ozyegin.edu.tr
EDUCATION
08 /2002 University of Florida, Gainesville, FL
Ph.D. in Materials Science and Engineering
• Dissertation: Formulation of Engineered Particulate Systems for Chemical Mechanical Polishing Applications.
• Graduate Advisor: Dr. Brij M. Moudgil
• Specialty: Electronic Materials/ Particle & Surface Science
• Certificate in Particle Science and Technology by College of Engineering and Engineering Research Center for Particle Science and Technology.
• Certificate in Surfactants: Principles & Applications by Center for Surface Science and Engineering and Engineering Research Center for Particle Science and Technology.
• Research Assistant
12 /1997 Virginia Polytechnic Institute and State University, Blacksburg, VA
Master of Science in Mining and Minerals Engineering
• Thesis: Fine Coal Dewatering
• Graduate Advisor: Dr. Roe-Hoan Yoon
• Research Assistant
07/1995 Middle East Technical University, Ankara, Turkey
Bachelor of Science in Mining Engineering
• Ranked first in graduating class
PROFESSIONAL EXPERIENCE
07/2009 – Present Ozyegin University, Istanbul, Turkey
* Assistant Professor, Mechanical Engineering Department
* Thin Film/Interface Characterization
* Chemical Mechanical Planarization Applications and Slurry Development
* Microelectronics Processing/Integration
* Biomaterials/Bio interfaces
* Particle Science and Technology
* Colloids and Surface Chemistry
* ECS CMP Organizing Committee Member
10/2005 – 07/2009 Texas Instruments, Dallas, Texas
* Process Integration Engineer, TI Analog Technology Development Group (11/08-07/09)
* Process integration and manufacturability assessment/ improvement responsibilities for Ferroelectric Memory Development.
* FRAM packaging integration
* Product Engineer, TI DM5, Flash Technologies (01/08-10/08)
* Product owner for 130 and 90nm automotive devices.
* Customer support working with planning and quality teams.
* Inline yield improvement through process optimization based on product yield correlation.
* EOL test program coverage and affectivity improvement working with local business entity.
* Moat Defect Focus Team leader (01/08-10/08)
* CMOS/Analog/Flash technologies, integration and defect improvement through product engineer owner and leadership of front end process groups.
* Process Engineer, TI DM5/ CMP Group/ STI CMP (10/05-12/07)
* Member Group Technical Staff
* MAKE Member of Technical Staff
* Lead STI CMP process engineer with sustaining, process improvement and process capability improvement responsibilities.
* Moat loop leader for flash technologies: Leading front end flash technology integration/defect reduction through root cause understanding of functionality failures and facilitating starting material improvement.
* Moat loop team member for STI CMP defect reduction projects ownership through improved qual development for consumable driven defect detection and process/consumable/equipment improvements for defect reduction.
* LBC8 development team member: Enabled the STI loop on TI’s first dual plane product with embedded flash.
* LBC8 High Voltage Devices- Deep Trench Development: TI’s first STI loop process development on deep trench isolation resulting in 6-26% area savings on high voltage device design through improved front end integration and enabling manufacturable STI CMP process
* DM5 communications team member.
08/2003 – 10/2005 Intel Corporation, Santa Clara, California
Senior Process Engineer, Intel California Technology Manufacturing/ Thin Films/ Planar Group
* Process development for 90/65 nm Flash and Flash + Logic technologies with concentration on defect reduction and process optimization, experimental design, statistical process control and yield improvement on Mirra and Westech polishers.
* Enabled 90nm STI CMP module capability through improved density design rule methodology and process integration.
* Designed a test device to optimize planarization of 65/45 nm flash technologies by defining criteria for consumable selection and defect reduction.
* Chemical Mechanical Planarization (CMP) slurry characterization/development for 90/65 nm Flash and Flash + Logic technologies.
* Front End CMP module owner for STI/Polysilicon Planarization (150nm, 90nm and 65 nm production and development).
* Front End /Mid Section Defect Team Co-Chair.
* Experienced with MirraTrac, Westech 572M, stand alone and on-trac DSS cleaners, Nova, Optiprobe, HRP, Tencor/KLA/SP1 tools and related software.
01/2003 – 07/2003 Engelhard Corporation, Gordon, Georgia
Process/Product Development Engineer, Engelhard Technical and Research Center
* Copper CMP slurry/abrasive development.
* Beneficiation of kaolin clays for paper coating applications.
05/1999 DuPont Central Research & Development, Wilmington, Delaware
Graduate Resident-in-Training Program, DuPont Particle Science and Technology (PARSAT) Department
* Studied the effects of sampling on the precision of the particle size analysis.
RESEARCH & DEVELOPMENT
04/2010 – present “Nano-Scale Protective Oxide Films for Semiconductor Applications & Beyond” European Commission-FP7 PEOPLE IRG Project, Ozyegin University Istanbul, Turkey
* Characterization of protective metal oxide thin films as they apply to CMP process.
* Evaluation of the interatomic forces within the metal-metal oxide interfaces.
* Modeling of nano-scale chemical and mechanical interactions in CMP to improve process performance on conventional materials such as W and Cu to construct basis of slurry formulation criteria.
* Optimization of the CMP slurry chemistry and particulate properties for the new generation semiconductor materials including Ge, GaAs and beyond.
10/2011 – present “Impact of Self Protective Oxide Film Growth, Controlled Roughness and Micro-Patterning on Infection Resistance and Biocompatibility Enhancement of Biological Implants” Ozyegin University Istanbul, Turkey
* CMP application on bio-implant materials to remove surface contamination and form self-protective oxide films to prevent further contamination.
* Inducing controlled surface roughness on implant surface through CMP to study the impact of surface texture on cell growth.
* Simulation of the best surface texture to enable wettability of the implant materials in simulated body fluids and experimental evaluation through hydroxyapatite and cell growth on the textured surfaces.
03/2011 – 08/2011 “Scalable, Low Stress, Digital CMP Process for 300/400mm Wafer Manufacturing of Ultra-low k Interconnects” National Institute of Standards and Technology (NIST) Grant, Ozyegin University in collaboration with the University of Florida, Gainesville, Florida
* Synthesis of functional nano-scale abrasive particles for CMP applications.
* Surfactant mediation of the CMP slurries to enable tunable polishing, selectivity and planarization performance.
* Optimized slurry formulation criterion studies based on adsorption characteristics of surfactants for new CMP technologies.
03/2011 – 08/2011 “Packaging Challenges for Ferroelectric Memory Devices” Consultant for Texas Instruments Incorporation
* Evaluation of alternative packaging techniques for the FRAM memory chips that can reduce the thermal process budget.
* Innovative techniques for the improved encapsulation of the ferroelectric memory arrays in FRAM process integration.
* Optimization of the processes for the top protective oxide film deposition for FRAM processing.
10/2005 – 07/2009 Texas Instruments, Dallas, Texas
* 130nm ferroelectric memory (FRAM) Development and manufacturability qualification 2008-2009 (Texas Instruments Inc.): Process integration and development for ferroelectric memory devices for RF ID, medical and mixed signal processing applications.
* High Voltage Devices- Deep Trench Development 2007-2008 (Texas Instruments Inc.): TI’s first STI loop process development on deep trench isolation resulting in 6-26% area savings on high voltage device design through improved front end integration (that lead to an IP disclosure) and enabling manufacturable STI CMP process.
* Flash Memory STI CMP Step Height Control 2008 (Texas Instruments Inc.): Device level recipe design to adjust STI CMP step height thickness based on device design/density variations to prevent Data Retention Loss (DRL) failures 5% yield gain.
* New High Selective Slurry Qualification 2008 (Texas Instruments Inc.): Development and implementation of low cost high selectivity slurry for STI CMP.
* CMP Slurry Prime Reduction 2007 (Texas Instruments Inc.): Implemented a reduced slurry prime recipe for STI CMP through balancing the slurry flow ratios to retain selectivity and rate while reducing HSS consumption.
* Consumable life extension 2007 (Texas Instruments Inc.): Implemented edge sealed pads. Evaluated new disks (outsourced to University of Arizona) to extend tool preventive maintenance frequency and inline defect reduction.
* Dual Plane STI CMP Development 2007 (Texas Instruments Inc.): Enabled the STI loop on TI’s first dual plane product (embedded flash) by integrated DOE design for STI CMP assessing thickness/defectivity within recessed area
* STI CMP Micro/Macro Scratch Reduction/Excursion Prevention 2006 (Texas Instruments Inc.):
• Implemented arc/macro scratch qual, normalized scratch monitors and 3-month slurry flush procedures at STI CMP to reduce inline scratches by 30% and gain 0.35% multiprobe yield end of the line.
• Micro scratch excursion prevention through improved quality slurry evaluation and point of use filtration implementation that reduced inline defect density by 3X and end of the line yield by 5%. Developed new qual procedure/recipe that detects CMP scratches on pilots pre committing production.
* Pilot Reduction 2006/2007 (Texas Instruments Inc.): Implemented new tool/process quals to control/reduce pilot consumption and enable tool trouble shooting. Created a re-cycling pilot device to reduce pilot cost.
* New Slurry Qualification 2006 (Texas Instruments Inc.): Qualified new slurry for STI CMP by evaluating HSS interaction through WIW/ WID/x-section analysis leading 3X lower scratch (better quality) and cost cut by lower price.
* Edge Nitride Removal 2006 (Texas Instruments Inc.): Eliminated remaining edge nitride on 250nm technology more prone to partial edge pattern by root cause analysis enabling uniform WIW density via added dummy shots reducing edge defects by 10X.
08/2003 – 10/2005 Intel Corporation, Santa Clara, California
* 90 nm Flash Capability Improvement 2005 (Intel Corporation): Increased STI module capability by 3X through improved design rule methodology increasing process yield by 8% and multiprobe yield by 15%.
* 65/45 nm Test Device Design for CMP Development 2005 (Intel Corporation): Enabled 65/45 nm flash starts by test device design to optimize CMP planarization and defect reduction.
* Microscratch reduction 2004 (Intel Corporation): Enabled 90-nm risk starts by providing 5X reduction in CMP microscratches and 10% end of line yield gain through process optimization.
08/1998 – 08/2002 National Science Foundation – Engineering Research Center (ERC) for Particle Science and Technology, University of Florida, Gainesville, Florida
* Modeled stress concentrations in native oxide films of metals to control mechanical fracture by corrosion during chemical mechanical planarization process.
* Worked with the Engineered Particulate Systems / Chemical Mechanical Polishing goal group of the Engineering Research Center.
* Trained on Westech 372 polisher (8”-wafer polishing)
* Conducted CMP with Struers Rotopol 31 tabletop polisher.
* Used Coulter LS 230, Acoustosizer, CHDF, BrookHaven Zeta Plus, Accusizer for the particle size analyses of CMP Slurries.
* Conducted Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) analysis.
* Used Fourier Transform Infrared Spectroscopy (FTIR).
* Studied nanosize particle coating for surface chemistry modification of silica powders using pulsed laser deposition.
* Synthesized Stober silica powders at sub-micron sizes.
* Supervised 6 undergraduate students in ERC research projects.
01/1996 – 12/1997 Center for Coal and Minerals Processing (CCMP), Virginia Polytechnic Institute and State University, Blacksburg, Virginia
* Worked on fine coal dewatering and developed novel techniques for decreasing the moisture content of coal for a project supported by the Department of Energy.
* Studied coal and sulfide minerals flotation.
* Synthesized chemicals used as dewatering aids.
* Conducted dewatering experiments using vacuum filtration technique in the presence of novel dewatering reagents.
* Performed centrifuge tests on fine coal at Bird Machine Company, Boston, MA.
* Studied surface chemistry of coal for filtration, utilized Surface Tension Apparatus, Contact Angle Goniometer and UV Spectrometer.
TEACHING EXPERIENCE
09/2009- present Ozyegin University, Department of Mechanical Engineering
• Freshman Calculus
• Chemistry for Engineering
• Materials Perspective in Industrial Design
• Advanced Polymer Processing
• Coherent Teachings of Energy, Environment and Economy to Build Smarter İstanbul 2050 (IBM Award lecturer)
10/2005- 09/2009 Texas Instruments Incorporated
• Member Group Technical Staff
• Make Member Technical Staff
• Make Mentoring Program
• Initiator and Process Engineering team leader of New Hire Training Focus Group
• Technical mentor for three engineers at TI-DMOS5 Semiconductor Fab
• Process Integration/defect reduction advisor for front end Flash technologies at TI-DMOS5 Semiconductor Fab
08/1998 – 08/2002 Department of Materials Science and Technology and National Science Foundation – Engineering Research Center (ERC) for Particle Science and Technology, University of Florida, Gainesville, Florida
* Assisted in teaching of (i) Interfacial Phenomena I and II (ii) Colloids and Surface Chemistry (iii) Particle Science and Technology
* Supervised four undergraduate students in senior thesis studies
PUBLICATIONS
Intellectual Property:
Basim, G.B, Kincal, S., Davis, E., “Predictive Method to Improve within Wafer CMP Uniformity through Optimized Pad Conditioning” US Pat. 7,899,571 – Filed 5 Nov 2008 – Granted March 1, 2011.
Basim G.B, Summerfelt S.R., Moise T.S., “Hydrogen Passivation of Integrated Circuits”, US Pat. App 20110079884 – Filed 24 Sep 2010, Assigned April 7, 2011.
Aggarwal R., Summerfelt S. R., Basim G. B. , Moise, T.S., “Ferroelectric Capacitor Encapsulated with a Hydrogen Barrier”, US Pat. App 20110079878 – Filed 7 Apr 2011- Assigned April 7, 2011.
Summerfelt S.R., Moise T.S., Basim G.B., “Passivation of Integrated Circuits Containing Ferroelectric Capacitors and Hydrogen Barriers”, US Pat. App 20100224961 – Filed 9 Sep 2010- Assigned September 9, 2010.
Davis G., Basim G.B. “Polish Pad Conditioning in Mechanical Polishing Systems” US Pat. App 20100124871- Filed 19 Nov 2008- Assigned May 20, 2010.
Moudgil B. M, Basim G. B., Vakarelski I. U., Brown S. C., “Materials and Methods for Control of Stability and Rheological Behavior of Particulate Suspensions,” ; US Pat. App 20040055993 – Filed April 21, 2003 – Assigned March 25, 2004.
Books:
Basim G.B., Engineered Particulate Systems for Chemical Mechanical Planarization, Lambert Academic Publishing, ISBN 978-3-8433-6346-4, 2011.
Book Chapters:
Vakarelski I. U. , Basim G.B and Moudgil B.M., “Atomic Force Microscopy Simulation of Interaction Forces in CMP Applications,” Encyclopedia of Nanoscience and Nanotechnology, Schwartz, J. A., C. Contescu, and K. Putyera, Eds., Marcel Dekker, ISBN 978-0-8247-5055-8, 2004.
Journals
Basim G. B., Mahajan U., Adler J.J., Moudgil B. M., Singh R. K., “Effect of Particle Size Distribution of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects,” Journal of the Electrochemical Society, Vol. 147, No 9, p. 3523-3528, September 2000.
Moudgil B. M. Basim G. B., “Particle Science and Technology Research and Education in the USA” Powder Science & Engineering, Vol. 34, No 6, p.43-48, 2002.
Basim G. B., Moudgil B. M., “Effect of Soft Agglomerates on CMP Slurry Performance,” Journal of Colloid and Interface Science, Vol. 256, No 1, p. 137-142, December 2002.
Singh R. K., Lee S-M, Choi K-S, Basim G. B., Choi W-S, Moudgil B.M., Chen Z., “Fundamentals of Dielectric and Metal Chemical Mechanical Planarization (CMP) Slurry Design,” MRS Bulletin, Vol. 27, No 10, p. 752-760, October 2002.
Basim G. B., Vakarelski I.U., Moudgil B. M., “Role of Interaction Forces in Controlling the Stability and Polishing Performance of CMP Slurries,” Journal of Colloid and Interface Science, Vol. 263, p. 506-515, 2003.
Basim G. B., Vakarelski I.U., Brown S., Moudgil B. M., “Strategies for the Optimization of Chemical Mechanical Polishing (CMP) Slurries,” The Journal of Dispersion Science and Technology, Vol. 24, No 3, p. 499-515, 2003.
Basim, G. B. and B. M. Moudgil, “Slurry Design for Chemical Mechanical Polishing,” Kona, Vol. 21, p.178-184, 2003.
Vakarelski I. U., Brown, S.C, Basim G.B, Rabinovich, Y. I., and Moudgil B.M., “Tailoring Silica Nanotribology for CMP Slurry Optimization: Ca2+ Cation Competition in C12TAB Mediated Lubrication
“, ACS Applied Materials & Interfaces, Vol. 2, No 4, pp. 1228-1235, 2010.
Basim, G.B., “Effect of Slurry Aging on Stability and Performance of Chemical Mechanical Planarization Process”, Advanced Powder Technology, Vol. 22, pp. 257-265, 2011.
Basim G.B., Kincal S., ” Impact of Pad Conditioning on Thickness Profile Control in Chemical Mechanical Planarization,” Journal of Electronic Materials, submitted for publication.
Proceedings
Basim, G. B. and Yoon R. -H., “Dewatering Fine Coal Using Novel Methods,” Proceedings of the Society for Mining, Metallurgy and Exploration Engineers Annual Meeting, 1997.
Basim G. B., Mahajan U., Adler J.J., Moudgil B. M., Singh R. K., “Optimal Size Distribution of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects,” in Chemical Mechanical Polishing in IC Device Manufacturing III., Y. A. Arimoto, R. L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, and Y. Homma, Editors, p.369, Electrochem. Soc. Proc., PV 99-37, Honolulu, Hawaii, October 1999.
Basim G. B., Adler J.J., Mahajan U., Singh R. K., Moudgil B. M., “Developing Engineered Particulate Systems for Oxide Chemical Mechanical Polishing,” in Chemical Mechanical Planarization IV. R. L. Opila, C. Reidsema-Simpson, K. B. Sundaram, S. Seal, Editors, p. 45, Electrochem. Soc. Proc., PV 2000-26, Phoenix, Arizona, October 2000.
Basim G. B., Khalili M.A., Rohricht W., Moudgil B. M., “Effect of Sampling on Precision of Particle Size Analysis,” Proceedings of the International Mineral Processing Symposium, p. 75-80, Antalya, Turkey, October, 2000.
Moudgil B. M., Basim G. B., “How Stable Does a CMP Slurry Need to Be?,” Proceedings of the Fourth BCC Conference on Fine, Ultrafine and Nano Particles, 2001.
Moudgil B. M., Basim G. B., P. K. Singh, J. J. Adler, Y.I. Rabinovich “Dispersion of Nanoparticulates Under Extreme Environments Using Self-Assembled Surfactant Aggregates,” Proceedings of the American Ceramic Society for Improved Ceramics through New Measurements, Processing, and Standards Symposium, 2001.
Yoon R-H., Asmatulu R., Basim G. B., Walters A. D., Luttrell G. H. “Pilot-Scale Testing of Novel Fine Particle Dewatering Aids,” Proceedings of the XIV International Coal Preparation Congress and Exhibition, Johannesburg, South Africa, March 2002.
Basim G. B., Vakarelski I., Singh P. K., Moudgil B. M., “Control of Particle-Particle and Particle-Surface Interactions to Improve CMP Performance,” MRS Proceedings, Spring 2002 Meeting, San Francisco, CA, April 2002.
Basim G. B., Vakarelski I., Singh R. K., Moudgil B. M., “Controlled Stabilization of Chemical Mechanical Polishing Slurries,” 4th World Congress on Particle Technology, Sydney, Australia, July 2002.
Basim G. B., Moudgil B. M., “Fundamentals of Slurry Design and Engineering,” MRS Proceedings, Fall 2002 Meeting, Boston, MA, October 2002.
Basim G.B., Kincal S., “Yield Improvement through Optimized Pad Conditioning for CMP Applications,” ECS 2006 Joint International Meeting, Cancun, Mexico, October 2006.
Basim G.B., Metal CMP Optimization Based on Chemically Formed Thin Film Analysis, ECS Transactions, 216th Electrochemical Society Meeting, ULSI Process Integration 6, 25- 7, pp: 315-326, Vol. 25, Issue 7, Vienna, Austria, October 2009.
Basim, G.B., Brown, S.C., Vakerelski, I.U., Moudgil, B.M., “Tailoring Silica Nanotribology in Aqueous Environments: A case study on Chemical Mechanical Planarization.” 6th World Particle Congress (WCPT6), Nuremberg, Germany, April 2010.
Basim, G.B., Nanotechnology and Energy, Nanotoxicity and Environment, Advanced Technologies Workshop, Kocaeli, Türkiye, pp. 179, April 2010.
Basim, G.B, Kincal, S., “A Model of Chemical Mechanical Planarization to Predict Impact of Pad Conditioning on Process Performance” Proceedings of MRS Spring Meeting, San Francisco, CA, April 2012 (Forthcoming).
Basim, G.B., Karagoz, A., Ozdemir, Z., “Advanced Slurry Formulations for New Generation Chemical Mechanical Planarization (CMP) Applications” Proceedings of MRS Spring Meeting, San Francisco, CA, April 2012 (Forthcoming).
Basim, G.B., Ozdemir, Z., Karagoz, A., “Evaluation of Cell Growth and Infection Resistance through Micro-Patterning on Biological Implants”, Proceedings of MRS Spring Meeting, San Francisco, CA, April 2012 (Forthcoming).
PRESENTATIONS
Basim G. B., Adler J. J., Singh P. K., Moudgil B. M., “Size Distribution Analysis in Ultrafine Particulate Systems,” NSF-ERC Science Advisory Board (SAB)-Industrial Advisory Board (IAB) Meeting, Gainesville FL, February 1999.
Basim G. B., Mahajan U., Adler J. J., Moudgil B. M., Singh R. K., “Engineered Slurries for Enhanced Polishing with Minimal Defects,” NSF-ERC, SAB-IAB Meeting, Gainesville FL, October 1999.
Basim G. B., Mahajan U., Adler J. J., Moudgil B. M., Singh R. K., “Optimal Size Distribution of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects” 196th Meeting of the Electrochemical Society, Honolulu, Hawaii, October 1999.
Basim G. B., Adler J., Mahajan U., Moudgil B. M., Singh R. K., “Effects of Hard and Soft Agglomerates in Chemical Mechanical Polishing Slurries on Polishing Performance,” 13th Symposium on Surfactants in Solution (SIS-2000), Gainesville FL, June 2000.
Basim G. B., Adler J. J., Mahajan U., Singh R. K., Moudgil B. M., “Developing Engineered Particulate Systems for Oxide Chemical Mechanical Polishing,” 198th Meeting of the Electrochemical Society, Phoenix AZ, October 2000.
Basim G. B., Adler J. J, Singh R. K., Moudgil B. M., “Effects of Soft Agglomerates in CMP Slurries on Polishing Performance,” Particles 2001 Meeting, Orlando FL, February 2001.
Basim G. B., Adler J. J., Singh P. K., Singh R. K., Moudgil B. M., “Role of Particle-Particle and Particle-Surface Interactions in CMP Slurry Performance,” NSF-ERC, SAB-IAB Meeting, Gainesville FL, April 2001.
Basim G. B., Adler J., Singh P. K., Singh R. K., Moudgil B. M., “Controlled Stabilization of CMP Slurries for Optimal Performance,” NSF-ERC, SAB-IAB Meeting, Gainesville FL, February 2002.
Basim G. B., Singh P. K., Vakarelski I., Moudgil B. M., “Engineering the Interaction Forces to Optimize CMP Performance,” Materials Research Society Meeting, San Francisco, California, April 2002.
Basim G. B., Singh P. K., Singh R. K., Moudgil B. M., “Engineering the Stability of Chemical Mechanical Polishing Slurries,” 223rd ACS Meeting, Orlando FL, April 2002.
Basim G. B., Singh P. K., Rabinovich Y. I., Moudgil B. M., “Self-Assebled Surfactant Mediated Dispersion of Nanoparticulate Systems for CMP,” 6th International Conference on Nanostructured Materials, Orlando FL, June 2002 (Invited).
Basim G. B., Vakarelski I.U., Singh P. K., Moudgil B. M., “Design Guidelines for Developing Optimally Performing CMP Slurries,” NSF-ERC, IAB Meeting, Gainesville FL, September 2002.
Basim G.B., “Formulation of Engineered Particulate Systems for Chemical Mechanical Polishing Applications,” Los Alamos National Laboratory, Los Alamos NM, October 2002 (Invited presentation- job offer).
Basim G.B., “Formulation of Engineered Particulate Systems for Chemical Mechanical Polishing Applications,” Columbia University, New York, NY, January 2003 (Invited presentation).
Basim G.B., Kincal S., “Yield Improvement through Optimized Pad Conditioning for CMP Applications,” ECS 2006 Joint International Meeting, Cancun, Mexico, October 2006.
Basim G.B., Kincal S., “Yield Improvement through Optimized Pad Conditioning for CMP Applications,” Texas Instruments Yield Symposium, Dallas TX, July 2007.
Basim, G. B., Wofford, A. B., Pendharkar, S., “Challenges in Deep Trench Isolation of LBC8 High Voltage Devices.” Texas Instruments MSTD Symposium, Dallas, TX, November 2007.
Basim, G. B., Nafikov, R., Masten, J. “Data Retention Loss Improvements through STI CMP Step Height Tuning.” Texas Instruments Yield Symposium, Dallas TX, July 2008.
Basim G.B., “Metal CMP Optimization Based on Chemically Formed Thin Film Analysis”, ECS 2009 International Meeting, Vienna, Austria, October 2009.
Basim, G.B., Brown, S.C., Vakarelski, I.U., Moudgil, B.M., “Tailoring Silica Nanotribology in Aqueous Environments: A case study on Chemical Mechanical Planarization.” 6th World Particle Congress (WCPT6), Nuremberg, Germany, April 2010.
Basim, G.B., Nanotechnology and Energy, Nanotoxicity and Environment, Advanced Technologies Workshop, Kocaeli, Türkiye, April 2010.
Karagöz A., Basim G.B., “Nano-Scale Protective Oxide Films for Semiconductor and Biomedical Applications”, Biotechnology Congress, Yeditepe University, İstanbul, Turkey, May 2010.
Webb, K.D., Mengüç, M.P, Ertürk, H., Basim G.B., “Technique for Measurement of Near-Field Radiation Heat Transfer Between Parallel Planes with Nano-Scale Spacing”, 14th International Heat Transfer Conference, Antalya, Turkey, June 2010.
Karagoz, A., Basim, G.B., “Slurry Design for Advanced Chemical Mechanical Planarization (CMP) Applications”, 2nd Applied Physics and Materials Science Congress, Antalya, Turkey, April, 2012 (Forthcoming).
Basim, G.B, Kincal, S., “A Model of Chemical Mechanical Planarization to Predict Impact of Pad Conditioning on Process Performance” MRS Spring Meeting, San Francisco, CA, April 2012.
Basim, G.B., Karagoz, A., Ozdemir. Z., “Advanced Slurry Formulations for New Generation Chemical Mechanical Planarization (CMP) Applications” MRS Spring Meeting, San Francisco, CA, April 2012.
Basim, G.B., Ozdemir, Z., Karagoz, A., “Evaluation of Cell Growth and Infection Resistance through Micro-Patterning on Biological Implants”, MRS Spring Meeting, San Francisco, CA, April 2012.
Basim, G.B., Aral, A., “Biomedical Applications of Chemical Mechanical Planarization Process“, 6th International Conference on Advanced Computational Engineering and Experimenting, Istanbul, Turkey, June 2012 (Forthcoming).
Basim, G.B., Karagoz, A., Ozdemir Z., “Metal Oxide Nano Film Characterization for CMP Optimization”
222nd ECS Meeting – Honolulu, Hawaii, October 2012 (Forthcoming).
HONORS AND AFILLIATIONS
12/2009 European Commission-FP7 PEOPLE Marie Curie International Reintegration Grant for project entitled “Nano-Scale Protective Oxide Films for Semiconductor Applications & Beyond”.
10/2008 Elected to participate and received Certificate in Asian American Citizens Council (AACC) Leadership program
05/2008 Certificate in Clemson University Professional Development for Women
04/2008 Certificate of Completion 2007-2008 TMG Cross-organizational Mentoring program
11/2007 Elected to Texas Instruments Corporation MAKE Group of Technical Staff for outstanding contributions in semiconductor research and development.
04/2007 Certificate in Clemson University Professional Development for Women
11/2006 Elected to Texas Instruments Corporation MAKE Member of Technical Staff for outstanding contributions in semiconductor research and development.
06/2005 Intel California Technology & Manufacturing Thin Films/Planar Division Award “For Improvement in STI Module Capability through Improved Design Rule Methodology and Rapid Integration of Process Improvements”.
08/2004 Intel California Technology & Manufacturing Award Certificate
“In recognition of outstanding effort and teamwork to enable P805 risk starts by providing a 5-x reduction in microscratches in less than 3 weeks”.
02/2004 Nominated for “Unilever award for Outstanding Young Investigator in Colloid & Surfactant Science”
12/2003 Intel California Technology & Manufacturing Award Certificate
“In recognition of strong dedication in supporting the P874 new product introduction”.
10/2003 Intel California Technology & Manufacturing Award Certificate
“In recognition of outstanding ownership of the P804 backside defect investigation, through data analysis and root cause understanding”.
09/2000 First place in poster contest in National science Foundation and Industrial Advisory Board Meeting, Gainesville, Florida with “Particle Size Distribution Effects on Chemical Mechanical Polishing Slurry Formulations”
03/2000 First place in poster contest in Industrial Advisory Board Meeting, Gainesville, Florida with “Monitoring the Effects of Hard and Soft Agglomerates in CMP Slurries on Polishing Performance”
04/1999 University of Florida Certificate of Award for Academic Achievement
08/02 – present University of Florida Alumni Association
12/01 – 08/02 Graduate Student Leadership Committee at the ERC
03/96 – present Phi Beta Delta Honor Society for International Scholars
12/97 – present Virginia Tech Alumni Association
PROFESSIONAL AFILLIATIONS
09/2011 – present Referee for Advanced Powder Technology (APT)
10/2010- present American Chemical Society (invited)
01/2007 – present Texas Instrument Member Group Technical Staff
01/2006- 12/2006 Texas Instruments Make Member of Technical Staff
10/2005- 07/2009 Texas Instruments Women Initiative Network Member
10/2002 – present Referee for Journal of Materials Research (JMR)
01/2000 – present Materials Research Society (MRS)
08/1999 – present Electrochemical Society (ECS)
11/1995 – 04/2001 Society for Mining, Metallurgy and Exploration Engineers (SME)